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improve construction efficiency
As a form-in-place gasket/sealant
Class H insulation
and only auxiliary curing methods can be relied on
Loctite 3609 Epoxy Gel for Pre-Wave Soldering low temperature cure improve construction efficiencyAdhesive epoxy gel for bonding surface mount components to printed circuit boards prior to wave soldering LOCTITE 3609 is a dark red tacky epoxy gel suitable for bonding surface mount components to printed circuit boards prior to wave soldering. It is particularly suitable for applications requiring medium to high dispensing speeds, high precision dispensing specifications, high wet strength and good electrical properties.
